EPC2012C
EPC2012C
Part Number EPC2012C
Manufacturer EPC
Description GANFET TRANS 200V 5A BUMPED DIE
Package / Case Die
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Lead Time To be Confirmed
Detailed Description N-Channel 200V 5A (Ta) Surface Mount Die Outline (4-Solder Bar)
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EPC2012C - Product Attributes
Categories
Discrete Semiconductor Products / Transistors - FETs, MOSFETs - Single
Datasheet EPC2012C Datasheet
Standard Package 2500
Manufacturer EPC
Series eGaN®
Packaging Tape & Reel (TR)
Part Status Active
FET Type N-Channel
Technology GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss) 200V
Current - Continuous Drain (Id) @ 25°C 5A (Ta)
Drive Voltage (Max Rds On, Min Rds On) 5V
Rds On (Max) @ Id, Vgs 100mOhm @ 3A, 5V
Vgs(th) (Max) @ Id 2.5V @ 1mA
Gate Charge (Qg) (Max) @ Vgs 1.3nC @ 5V
Vgs (Max) +6V, -4V
Input Capacitance (Ciss) (Max) @ Vds 140pF @ 100V
FET Feature -
Power Dissipation (Max) -
Operating Temperature -40°C ~ 150°C (TJ)
Mounting Type Surface Mount
Supplier Device Package Die Outline (4-Solder Bar)
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EPC2012C - Tags